Fanless embedded system with Intel® C246 Chipset and Dual PCIe Slots.
2x260Pin DDR4 SO-DIMM 2666Mhz up to 32GB, 1xHDMI, 1xDisplayPort, 1xDVI-I, 2xGbE LANs, 6xUSB3.0, 2xUSB2.0, 2xCOM, PCIex16+PCIex1, 9~48V DC-in.   Operation temperature -40°C ~ 70°C with 35W TDP Processor. without AC adaptor

CPU 9th & 8th Gen Intel® Coffee Lake Xeon LGA1151 Socket Processor, 6-core TDP Max. 80W / 9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor, Core i7/i5/i3 6-core TDP Max. 65W, Core i9 8-core TDP Max 35W / *Please see the CPU Options in Docs / Manuals
CHIPSET Intel® C246
SYSTEM MEMORY Max. 64GB (Xeon: ECC / Non-ECC; Core-i: Non-ECC) / DDR4 2666MHz / 2 x 260-pin SO-DIMM
GRAPHICS Intel® HD Graphics
DISPLAY INTERFACE DisplayPort 1.2 / DVI-I / HDMI 1.4
STORAGE SLOT 3 x 2.5 HDD / SSD (1 w/ Removable HDD Bay, 2 w/ Internal HDD Bracket) / 2 x mSATA / 1 x M.2 M Key SSD
ETHERNET Intel® I219-LM Giga LAN + I210-IT Giga LAN
AUDIO Realtek® ALC662 / ALC888
I/O CHIPSET Nuvoton NCT6116D
TPM Nuvoton NPCT750AAAYX TPM2.0
EXPANSION SLOT Storage: M.2 2280 / 2260 / 2242 M key (PCIe, SATA) / PCIe 3.0 X16 slot / Storage/LTE/Wireless: 2 x mPCIe Full / Half size (USB2.0 / PCIex1 / SATAIII), w/ SIM Card Holder / Wireless: M.2 2230 E key (PCIe, USB)
INTERNAL SPEAKER 1 x Buzzer
INDICATOR DIO LED / LAN1 & 2 ACT / SPEED / Power LED / HDD LED
FRONT I/O 1 x HDMI 1.4 / 2 x USB 3.0 / 2 x SIM Card Slot w/ Cover / 1 x 2.5" SATAIII HDD / SSD Bay
REAR I/O 1 x DisplayPort 1.2 / 1 x DVI-I / 2 x RJ-45 / 4 x USB 3.1 Gen 2 (10 Gbps) / 2 x USB 2.0 / 2 x RS232 / 422 / 485 (Support Power 5V / 12V) / 1 x Mic-in / 1 x Line-out / 1 x PS/2 / 1 x PCIe x16 slot / 1 x 2-pin Terminal Block Remote Power Reset / 1 x 3-pin Terminal Block Power Input / 1 x 4-pin Terminal Block External Fan Connector / 1 x 2-pin Terminal Block Remote Power on / off / 4 x SMA Antenna (Optional for WiFi/LTE function)
EDGE AI ENGINE (Optional) 1X/2X/3X/4X Movidius Myriad X VPU, and Intel® OpenVINO™ toolkit supported (Optional)
POWER REQUIREMENT POWER INPUT 9~48V Wide Range DC Input w/ Terminal Block Connectivity
POWER ADAPTER Optional
ENVIRONMENTAL OPERATING TEMPERATURE 35W TDP Processor: -40°C to 70°C / 51~65W TDP Processor: -40°C to 50°C / 71~80W TDP Processor: -40°C to 40°C / with 0.7m/s Air Flow and Wide Temperature Memory/Storage
STORAGE TEMPERATURE -40 ~ 85°C (-40 ~185°F)
OPERATING HUMIDITY 10% ~ 90% R/H (Non-condensing)
STORAGE HUMIDITY 10% ~ 95% @85°C non-condensing
VIBRATION RESISTANCE Operating: 5Hz~500Hz / 5Grms / 3Axis (w/ SSD, according to IEC60068-2-64)
SHOCK RESISTANCE Operating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)
CERTIFICATION CE / FCC Class A / E-Mark Certification (E13, No.10R-0515319) / EN50155 / LVD CoC: EN62368-1
MECHANICAL THERMAL DESIGN Fanless
MOUNTING Wallmount
DIMENSIONS (W X D X H) 10.6” x 9.7” x 4.3” (268 x 246 x 108 mm)
WEIGHT 6.9kg (15.2 lb)
OS OS SUPPORT Windows® 10 64-bit / Linux (support by request)
PACKING LIST PACKAGE 1 x Quick Installation Guide / 1 x Embedded System / 1 x CPU Cooler (passive) / 1 x Wall Mount Brackets / 1 x 3 pin Terminal Block Power Connector / 1 x 4 pin Terminal Block Male Connector / 2 x 2 pin Terminal Block Male Connector / 1 x DVI to VGA converter / 1 x 30 cm SATA & SATA PWR Y Cable (3rd SSD/HDD needs optional SATA Y cable)

Powerful Coffee Lake-S Xeon Processor

MiTAC's MX1-10FEP embedded system is the next generation embedded system with Intel® Coffee Lake C246 workstation chipset which can support Xeon and Core-i LGA1151 socket type processor. The excellent performance, powerful processor, OCP/OVP power protection, and expandable design provide the solution for every complicated task and most types of application.

The MX1-10FEP's 7.8 liter fan-less chassis design and Xpandable module design give it the possibility to implement the complicated tasks and for every workspace and environment. VESA mount holes allow for space-saving and rear-mounting on VESA arms. Flexibilities also mean a rich array of I/O ports (including 2 x Ethernet RJ45, 8 x USB, 1 x HDMI, 1 x DVI-I, 1 x DisplayPort, 2 x COM, PCIe X16 slot, 3-pin Terminal Block Power Input, and 3 x Expansion doors) to add a variety of peripherals. Storage expandability is supported for 3 x high-density hard drives in 2.5" HDD bracket design. Two mPCIe (shared with mSATA) slots provide the support of SSD and wireless interfaces which allow effortless connection to Wi-Fi and Bluetooth networks, and 4Gconnectivity. DIO/COM/LAN/PoE/Power Ignitoin expansion modules extend the capability and possibility to be used in more applications.
 

Xeon

• Up to 1.36X Performance Improvement compared to the previous generation
• Fanless design with up to Xeon TDP 80W

Core i

Up to 1.15X Performance Improvement compared to 7th generation

Support ECC DDR4 Memory

Versatile Xpansion Modules

Tested by major players specializing in the automation sector, the versatile Xpansion Module design, offers various I/O functionalities through its lower clever cost effective modulation, providing all functions within one system.

• Versatile I/O connectivity. Up to 12 LAN, 10 PoE, 10 COM, 16 DIO
• Power ignition Xpansion module for vehicle application

MS-48CDN-DT10

Expansion Module with 4 x RS232 / 422 / 485, 8-bit Isolated DIDO (4 x DI, 4 x DO)

MS-04LAN-R10

Expansion Module with 4 x Intel i210-IT Giga LAN, RJ45 Port
 

MS-04LAN-M10

Expansion Module with 4 x Intel i210-IT Giga LAN, M12 Port
 

MS-04POE-R10

Expansion Module with 4 x PoE+, Intel i210-IT Giga LAN, RJ45 Port

MS-04POE-M10

Expansion Module with 4 x PoE+, Intel i210-IT Giga LAN, M12 Port

ME-02POE-R10

Expansion Module with 2 x PoE+, Intel i210-IT Giga LAN, RJ45 Port

MS-01IGN-S10

Vehicle Power Ignition Card, 12V/24V and Power ON/OFF Timing Selectable

 

 

Edge AI Accelerator

4 X Intel® Movidius™ Myriad™ X for Edge AI

Maximum AI Cores:
Up to 4 x Movidius Myriad X

Support Intel OpenVINO Toolkit

Supported Framework:
TensorFlow, Caffe, MXNET

Supports High Resolution Triple Display

Supports triple independent displays (VGA + HDMI+DVI). The HDMI & DisplayPort up to 4K high resolution. The enhanced visual quality responses the demand of being high precise.

• Display Port 1.2 (4K@60Hz)
• HDMI 1.4 (4K@30Hz)
• DVI-I (FHD@60Hz)

Advanced Power Protection

Wide Power Range

9V~48V

Protection

• Reverse Power Input Protection
• Over Voltage Protection: 58V
• Over Current Protection: 15A
• ESD Protection: +/-15kV (air), +/-8kV (contact)
• Surge Protection: 3kW

-40~70oC Wide Temperature

MX1-10FEP is designed in patented aluminum enclosure not only for atheistic appearance but also for fan-less application in extreme temperature condition from 40 oCC to 70 oCC.

Certificate

MX1-10FEP are certified and all units undergo severe environmental testing to ensure reliable performance under a variety of automation conditions.

Dimension (mm)

MX1-10FEP I/O