Fanless embedded system with Intel® C246 Chipset and Dual PCIe Slots. 2x260Pin DDR4 SO-DIMM 2666Mhz up to 32GB, 1xHDMI, 1xDisplayPort, 1xDVI-I, 2xGbE LANs, 6xUSB3.0, 2xUSB2.0, 2xCOM, PCIex16+PCIex1, 9~48V DC-in. Operation temperature -40°C ~ 70°C with 35W TDP Processor. without AC adaptor
CPU 9th & 8th Gen Intel® Coffee Lake Xeon LGA1151 Socket Processor, 6-core TDP Max. 80W / 9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor, Core i7/i5/i3 6-core TDP Max. 65W, Core i9 8-core TDP Max 35W / *Please see the CPU Options in Docs / Manuals CHIPSET Intel® C246 SYSTEM MEMORY Max. 64GB (Xeon: ECC / Non-ECC; Core-i: Non-ECC) / DDR4 2666MHz / 2 x 260-pin SO-DIMM GRAPHICS Intel® HD Graphics DISPLAY INTERFACE DisplayPort 1.2 / DVI-I / HDMI 1.4 STORAGE SLOT 3 x 2.5 HDD / SSD (1 w/ Removable HDD Bay, 2 w/ Internal HDD Bracket) / 2 x mSATA / 1 x M.2 M Key SSD ETHERNET Intel® I219-LM Giga LAN + I210-IT Giga LAN AUDIO Realtek® ALC662 / ALC888 I/O CHIPSET Nuvoton NCT6116D TPM Nuvoton NPCT750AAAYX TPM2.0 EXPANSION SLOT Storage: M.2 2280 / 2260 / 2242 M key (PCIe, SATA) / PCIe 3.0 X16 slot / Storage/LTE/Wireless: 2 x mPCIe Full / Half size (USB2.0 / PCIex1 / SATAIII), w/ SIM Card Holder / Wireless: M.2 2230 E key (PCIe, USB) INTERNAL SPEAKER 1 x Buzzer INDICATOR DIO LED / LAN1 & 2 ACT / SPEED / Power LED / HDD LED FRONT I/O 1 x HDMI 1.4 / 2 x USB 3.0 / 2 x SIM Card Slot w/ Cover / 1 x 2.5" SATAIII HDD / SSD Bay REAR I/O 1 x DisplayPort 1.2 / 1 x DVI-I / 2 x RJ-45 / 4 x USB 3.1 Gen 2 (10 Gbps) / 2 x USB 2.0 / 2 x RS232 / 422 / 485 (Support Power 5V / 12V) / 1 x Mic-in / 1 x Line-out / 1 x PS/2 / 1 x PCIe x16 slot / 1 x 2-pin Terminal Block Remote Power Reset / 1 x 3-pin Terminal Block Power Input / 1 x 4-pin Terminal Block External Fan Connector / 1 x 2-pin Terminal Block Remote Power on / off / 4 x SMA Antenna (Optional for WiFi/LTE function) EDGE AI ENGINE (Optional) 1X/2X/3X/4X Movidius Myriad X VPU, and Intel® OpenVINO™ toolkit supported (Optional) POWER REQUIREMENT POWER INPUT 9~48V Wide Range DC Input w/ Terminal Block Connectivity POWER ADAPTER Optional ENVIRONMENTAL OPERATING TEMPERATURE 35W TDP Processor: -40°C to 70°C / 51~65W TDP Processor: -40°C to 50°C / 71~80W TDP Processor: -40°C to 40°C / with 0.7m/s Air Flow and Wide Temperature Memory/Storage STORAGE TEMPERATURE -40 ~ 85°C (-40 ~185°F) OPERATING HUMIDITY 10% ~ 90% R/H (Non-condensing) STORAGE HUMIDITY 10% ~ 95% @85°C non-condensing VIBRATION RESISTANCE Operating: 5Hz~500Hz / 5Grms / 3Axis (w/ SSD, according to IEC60068-2-64) SHOCK RESISTANCE Operating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) CERTIFICATION CE / FCC Class A / E-Mark Certification (E13, No.10R-0515319) / EN50155 / LVD CoC: EN62368-1 MECHANICAL THERMAL DESIGN Fanless MOUNTING Wallmount DIMENSIONS (W X D X H) 10.6” x 9.7” x 4.3” (268 x 246 x 108 mm) WEIGHT 6.9kg (15.2 lb) OS OS SUPPORT Windows® 10 64-bit / Linux (support by request) PACKING LIST PACKAGE 1 x Quick Installation Guide / 1 x Embedded System / 1 x CPU Cooler (passive) / 1 x Wall Mount Brackets / 1 x 3 pin Terminal Block Power Connector / 1 x 4 pin Terminal Block Male Connector / 2 x 2 pin Terminal Block Male Connector / 1 x DVI to VGA converter / 1 x 30 cm SATA & SATA PWR Y Cable (3rd SSD/HDD needs optional SATA Y cable)
Powerful Coffee Lake-S Xeon Processor MiTAC's MX1-10FEP embedded system is the next generation embedded system with Intel® Coffee Lake C246 workstation chipset which can support Xeon and Core-i LGA1151 socket type processor. The excellent performance, powerful processor, OCP/OVP power protection, and expandable design provide the solution for every complicated task and most types of application. The MX1-10FEP's 7.8 liter fan-less chassis design and Xpandable module design give it the possibility to implement the complicated tasks and for every workspace and environment. VESA mount holes allow for space-saving and rear-mounting on VESA arms. Flexibilities also mean a rich array of I/O ports (including 2 x Ethernet RJ45, 8 x USB, 1 x HDMI, 1 x DVI-I, 1 x DisplayPort, 2 x COM, PCIe X16 slot, 3-pin Terminal Block Power Input, and 3 x Expansion doors) to add a variety of peripherals. Storage expandability is supported for 3 x high-density hard drives in 2.5" HDD bracket design. Two mPCIe (shared with mSATA) slots provide the support of SSD and wireless interfaces which allow effortless connection to Wi-Fi and Bluetooth networks, and 4Gconnectivity. DIO/COM/LAN/PoE/Power Ignitoin expansion modules extend the capability and possibility to be used in more applications. Xeon Up to 1.36X Performance Improvement compared to the previous generation Fanless design with up to Xeon TDP 80W Core i
Up to 1.15X Performance Improvement compared to 7th generation
Support ECC DDR4 Memory
Versatile Xpansion Modules
Tested by major players specializing in the automation sector, the versatile Xpansion Module design, offers various I/O functionalities through its lower clever cost effective modulation, providing all functions within one system.
Versatile I/O connectivity. Up to 12 LAN, 10 PoE, 10 COM, 16 DIO Power ignition Xpansion module for vehicle application MS-48CDN-DT10
Expansion Module with 4 x RS232 / 422 / 485, 8-bit Isolated DIDO (4 x DI, 4 x DO)
Expansion Module with 4 x Intel i210-IT Giga LAN, RJ45 Port
Expansion Module with 4 x Intel i210-IT Giga LAN, M12 Port
Expansion Module with 4 x PoE+, Intel i210-IT Giga LAN, RJ45 Port
Expansion Module with 4 x PoE+, Intel i210-IT Giga LAN, M12 Port
Expansion Module with 2 x PoE+, Intel i210-IT Giga LAN, RJ45 Port
Vehicle Power Ignition Card, 12V/24V and Power ON/OFF Timing Selectable
Edge AI Accelerator 4 X Intel ® Movidius ™ Myriad ™ X for Edge AI
MX1-10FEP with AI modules powered by Intel
® Movidius ™ Myriad ™ X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation.
Maximum AI Cores:
Up to 4 x Movidius Myriad X
Support Intel OpenVINO Toolkit
TensorFlow, Caffe, MXNET
Supports High Resolution Triple Display
Supports triple independent displays (VGA + HDMI+DVI). The HDMI & DisplayPort up to 4K high resolution. The enhanced visual quality responses the demand of being high precise.
Display Port 1.2 (4K@60Hz) HDMI 1.4 (4K@30Hz) DVI-I (FHD@60Hz)
Advanced Power Protection Protection Reverse Power Input Protection Over Voltage Protection: 58V Over Current Protection: 15A ESD Protection: +/-15kV (air), +/-8kV (contact) Surge Protection: 3kW
-40~70 oC Wide Temperature
MX1-10FEP is designed in patented aluminum enclosure not only for atheistic appearance but also for fan-less application in extreme temperature condition from 40
oCC to 70 oCC.
MX1-10FEP are certified and all units undergo severe environmental testing to ensure reliable performance under a variety of automation conditions.