TANK-871-Q170i-i5/4G-R10

TANK-871-Q170i-i5/4G-R10
Embedded PC Q170/i5-6500TE/4GB/2xmPCIe/slim

● 6th Gen Intel® Core™ processor platform with Intel® Q170 chipset and DDR4 memory
● Triple independent display with high resolution support
● Rich high-speed I/O interfaces on one side for easy installation
● IEI iRIS-2400 solution

Chassis
Color
Black C + Silver
Dimensions (WxDxH) (mm)
82.2 x 255.2 x 204
System Fan
Fanless
Chassis Construction
Extruded aluminum alloy
Motherboard
CPU
Intel® Core™ i7-6700TE 2.4 GHzIntel® Core™ i5-6500TE 2.3 GHz
Chipset
Intel® Q170
System Memory
2 x 260-pin DDR4 SO-DIMM, pre-installed one 4GB (system max: 64GB)
IPMI
1 x iRIS-2400 (optional)
Storage
Hard Drive
2 x 2.5’’ SATA 6Gb/s HDD/SSD bay (RAID 0/1 support)
I/O Interfaces
USB 3.0
4
USB 2.0
4
Ethernet
2 x RJ-45LAN1 (iRIS): Intel® I210 PCIe controllerLAN2: Intel® I219LM PCIe controller
COM Port
4 on rear I/O (2 isolation)2 on rear I/O
Digital I/O
8 bit Digital I/O, 4 bit input / 4 bit output
Display
1 x VGA, 1 x HDMI+DP, 1 x IDP
Resolution
VGA: Up to 1920 x 1200@60HzHDMI: Up to 4096 x 2160@24Hz
Audio
1 x Line-out ; 1 x Mic-in
Wireless
1 x 802.11a/b/g/n/ac (optional)
Expansions
PCIe Mini
1 x Half-size PCIe Mini slot1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
Power
Power Input
DC Jack: 9 V~36 V DCTerminal Block: 9 V~36 V DC
Power Consumption
19 V@3.68 A (Intel® Core™ i7-6700TE with 8 GB memory)
Reliability
Mounting
Wall mount
Operating Temperature/Humidity
i7-6700TE: -20°C ~ 45°C with air flow (SSD),10% ~ 95%, non-condensingi5-6500TE: -20°C ~ 60°C with air flow (SSD),10% ~ 95%, non-condensing
Storage Temperature/Humidity
-40°C ~85°C with air flow (SSD), 10% ~ 90%, non-condensing
Operating Shock
Half-sine wave shock 5G; 11ms; 100 shocks per axis
Operating Vibration
MIL-STD-810G 514.6 C-1 (with SSD)
Weight (Net/Gross)
TBD
Safety/EMC
CE/FCC
OS
Supported OS
Microsoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E